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      Treating Machine

      Location: Home >Treating Machine

      PlasmaTEC-X

      product features:

      ·Easy installation
      ·Potential-free plasma process
      ·high speed
      ·control signal
      ·Automatically adjust airflow
      ·Standby airflow
      ·Small size and light weight
      ·Output discharge control
      ·PlasmaREMOTE



      Tantec's PlasmaTEC-X is a new surface treatment equipment designed based on the principle of high-voltage DC plasma discharge at atmospheric pressure. The device can be integrated into the robot system alone or on any production line.


      The plasma in the spray gun needs to be discharged under a certain pressure to release enough energy to treat the surface of the product. No matter how long the hose is, the PlasmaTEC-X host can automatically adjust the airflow in the spray gun, because the built-in AirTEC system can continuously provide a steady airflow for it.

      AirTEC system and unified power input make PlasmaTEC-X easier to use. No adjustment is required, just connect the power supply and compressed air and use it.
      A PlasmaREMOTE HMI controller can control 1-8 PlasmaTEC-X mainframes in daisy-chain mode simultaneously. These mainframes can be controlled individually through conventional relays or as a whole through the digital interface with the same main controller signals.

      The advanced design of the device is "low air volume to be used". With the HMI, the operator can set the air flow rate in standby mode to prevent dust from being attracted to the discharge electrode tip.

      All the nozzle connection ports of the PlasmaTEC-X main unit are standard sockets, so it is easier and more convenient to use. Based on DC discharge technology and AirTEC's design, no adjustments are required, no matter how long the connecting cable is.


      Features:
      ·Easy installation Just connect power and compressed air, no need to adjust air pressure and power.

      ·The potential-free plasma process treats conductive, non-conductive, and semiconductor product surfaces.
      ·Fast speed Plasma discharge energy is high, which can adapt to high-speed production lines.
      ·Control signals Various signals will be displayed on the digital interface to control and monitor the plasma discharge in real time.
      ·Automatically adjusts the air flow No matter how long the power cord or hose is, the host will automatically adjust to ensure that a proper amount of air pressure and gas flow is provided.
      ·Airflow in use Airflow is controlled by an electronic switch. A small portion of the airflow is set aside to avoid dust on the discharge electrode tip.
      ·Small size and light weight This feature makes PlasmaTEC-X easy to integrate into almost any production line or robotic system.
      ·Output discharge control If the output voltage is lower than the preset value, the host will issue an alarm signal.
      ·Control PlasmaREMOTE The parameters on this device can be controlled and adjusted via the HMI controller. HMI controller can monitor and control 1-8 PlasmaTEC-X.


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